中文

Product description

Product model

Design & development

  • CSP series

    Cmsemicon advanced CSP packaging product use ultra small package  and show good heat dissipation with less parasitic effects.


    Datasheet >
    CMS1D8B012CSPA1
    CMS2D1B012CSPA1
    CMS4D5B012CSPA1
    CMS5D5B012CSPA1
    CMS5D5B012CSPB1
    CMS014B012CSPA1
    CMS1D8B012CSPA
    CMS2D1B012CSPA
    CMS4D5B012CSPA
    CMS5D5B012CSPA
    CMS5D5B012CSPB
    CMS014B012CSPA

    Cmsemicon advanced CSP packaging product use ultra small package  and show good heat dissipation with less parasitic effects.

    Unique patented technology of planar process design can satisfy low resistance ,high short circuit currents and big avalanche capability with stronger mechanical strength.

    12V seriers products with low  resistance from 1.8mohm to 10mohm, which are suitable for applications such as single cell Li-Ion battery pack protection circuit . Strict quality management process implement through the whole process from design development to production testing data.


    Features
  • Product model

    Part Number Package VDS (V) ID(25℃) (A) RDSON@VGS=10V Typ.(mΩ) RDSON@VGS=4.5V Typ.(mΩ) RDSON@VGS=3.8V Typ.(mΩ) VGSth(V) Polarity VGS (±V)
    CMS1D8B012CSPA CSP 12 16 - 1.8 2.2 0.6 N+N 8
    CMS2D1B012CSPA CSP 12 13.5 - 2.1 2.5 0.6 N+N 8
    CMS4D5B012CSPA CSP 12 9 - 4.5 5 0.6 N+N 8
    CMS5D5B012CSPA CSP 12 8 - 5.5 7 0.6 N+N 8
    CMS5D5B012CSPB CSP 12 8 - 5.5 7 0.6 N+N 8
    CMS014B012CSPA CSP 12 3 - 10 11.5 0.6 N+N 8

  • Design & development

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